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Disco Corporation
DISPFDisco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. Its precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws. The company also offers precision processing tools, such as dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, cut-off wheels, and related products. In addition, it is involved in the maintenance, disassembly, and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its machines. Further, the company leases precision machines; and purchases and sells used machines. Additionally, it manufactures and sells precision diamond abrasive tools, as well as offers chargeable processing services. The company was founded in 1937 and is headquartered in Tokyo, Japan. Address: 13-11 Omori-Kita 2-chome, Tokyo, Japan, 143-8580
Analytics
Preço Alvo de Wall Street
8 947 089.23 JPYRácio P/E
39.2444Rendimento de dividendos
0.64 %Ano atual
Ano passado
Trimestre Atual
Ultimo quarto
Ano atual
Ano passado
Trimestre Atual
Ultimo quarto
Figuras chave DISPF
Análise de Dividendos DISPF
Crescimento de dividendos em 5 anos
138 %Crescimento contínuo
–Taxa de pagamento em média de 5 anos
39 %Histórico de Dividendos DISPF
Avaliação de ações DISPF
Relatório DISPF
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Inscreva-se no premiumResultados | 2019 | Dinâmica |