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Disco Corporation
DISPFDisco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. Its precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws. The company also offers precision processing tools, such as dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, cut-off wheels, and related products. In addition, it is involved in the maintenance, disassembly, and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its machines. Further, the company leases precision machines; and purchases and sells used machines. Additionally, it manufactures and sells precision diamond abrasive tools, as well as offers chargeable processing services. The company was founded in 1937 and is headquartered in Tokyo, Japan. Address: 13-11 Omori-Kita 2-chome, Tokyo, Japan, 143-8580
Analytics
Precio Objetivo de WallStreet
8 947 089.23 JPYRelación P/E
39.2444Rentabilidad por dividendo
0.64 %Año en curso
Año anterior
Trimestre actual
Último trimestre
Año en curso
Año anterior
Trimestre actual
Último trimestre
Cifras clave DISPF
Análisis de dividendos DISPF
Aumento del dividendo durante 5 años
138 %Crecimiento continuo
–Ratio de pago medio en 5 años
39 %Tendencia del payout DISPF
Valoración de la acción DISPF
Finanzas DISPF
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Hazte premiumResultados | 2019 | Dinámica |