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BE Semiconductor Industries NV
0XVEBE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company's principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands. Address: Ratio 6, Duiven, Netherlands, 6921 RW
Analytics
WallStreet Target Price
145.08 EURP/E ratio
53.6256Dividend Yield
1.92 %Current Year
Last Year
Current Quarter
Last Quarter
Current Year
Last Year
Current Quarter
Last Quarter
Key Figures 0XVE
Dividend Analytics 0XVE
Dividend growth over 5 years
23 %Continuous growth
–Payout Ratio 5 years average
99 %Dividend History 0XVE
Stock Valuation 0XVE
Financials 0XVE
Results | 2019 | Dynamics |