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Shinko Electric Ind Co Ltd
SHEGFShinko Electric Industries Co., Ltd. develops, produces, and sells various semiconductor packages in Japan. The company manufactures and sells plastic laminated packages, leadframes, heat spreaders, arresters, and ceramic electrostatic chuck products; and IC assemblies. It also offers various substrates comprising flip-chip package, plastic-BGA, coreless, and 2.3D package, as well as substrate with optical waveguides; thermal management parts, such as heat spreaders and carbon nanotube thermal interface materials; ceramic electrostatic chucks for semiconductor manufacturing equipment; and motor cores and precision die parts. In addition, the company provides device embedded packages, bare die flip-chip packages, molded underfill flip-chip packages, high-heat-dissipation flip-chip packages, and optical chiplet/co-packaged optics; glass-to-metal seals for LD devices and CAN packages for high-speed optical communication; and related technology. It serves computer and networking, mobile, industrial and IoT, and automotive industries. The company was founded in 1946 and is headquartered in Nagano, Japan. Shinko Electric Industries Co., Ltd. operates as a subsidiary of Fujitsu Limited. Address: 80, Oshimada-machi, Nagano, Japan, 381-2287
Analytics
WallStreet Target Price
939 855.05 JPYP/E ratio
36.724Dividend Yield
0.47 %Current Year
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Key Figures SHEGF
Dividend Analytics SHEGF
Dividend growth over 5 years
100 %Continuous growth
–Payout Ratio 5 years average
58 %Dividend History SHEGF
Stock Valuation SHEGF
Financials SHEGF
Results | 2019 | Dynamics |