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BE Semiconductor Industries NV
BESVFBE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company's principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands. Address: Ratio 6, Duiven, Netherlands, 6921 RW
Analytics
WallStreet Target Price
146.97 EURP/E ratio
54.0047Dividend Yield
1.89 %Current Year
Last Year
Current Quarter
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Current Year
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Current Quarter
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Key Figures BESVF
Dividend Analytics BESVF
Dividend growth over 5 years
23 %Continuous growth
–Payout Ratio 5 years average
99 %Dividend History BESVF
Stock Valuation BESVF
Financials BESVF
Results | 2019 | Dynamics |