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Union Semiconductor (Hefei) Co. Ltd. A
688403Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for integrated circuits in China. The company offers front-end gold bumps, wafer bumps, wafer testing, back-end chip-on-glass packaging, film-on-chip packaging, tape and reel chip package, and turnkey packaging and testing services for driver integrated circuits. Its products are used in TVs, laptops, mobile phones, tablets, digital cameras, and other consumer electronics. The company was founded in 2011 and is headquartered in Hefei, China. Address: No. 8, Xiangwang Road, Hefei, China, 230012
Analytics
WallStreet Target Price
–P/E ratio
48.2778Dividend Yield
1.07 %Current Year
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Key Figures 688403
Dividend Analytics 688403
Dividend growth over 5 years
–Continuous growth
–Payout Ratio 5 years average
–Dividend History 688403
Stock Valuation 688403
Financials 688403
Results | 2019 | Dynamics |